Semiconductor materials

Complete control of tape adhesion. The LINTEC Adwill series includes UV curable dicing tapes, high performance back grinding tapes, dicing die bonding tapes required for semiconductor packaging, and backside coating tapes. Adwill continues to make steady progress in the advancement of related equipment and unique systems.

European customers can find out more at LINTEC ADVANCED TECHNOLOGIES (EUROPE) GmbH at http://www.linteceurope.com.

For all other countries please visit http://www.LINTEC.co.jp/e-dept/english/adwill/

Semiconductor materials